All entries from the CV: 30 publications · 4 research interests · 11 career/education milestones.
30 Publications4 Research interests11 Milestones
Mar 2027publication
[C1] Octopus accepted by IEEE APEC 2027 (Lecture)
X. Wang, T. Min, X. Liu, and K. J. Chen, “Octopus: a 5-mm-Height 337-W/in³ Resonant Converter Ring Featuring Saturation-Free Magnetic Flux and Reduced Resonant Capacitor Ripple via Quad-Phase Coupled Inductors,” APEC 2027 (Accepted as Lecture).
X. Wang et al., “A 0.73 A/mm³ Switched-Capacitor-Stack-Inductor Volumetric Integrated Voltage Regulator with Auxiliary-Assisted Gain Boosting for High-Density PoL Applications,” IEEE JSSC, vol. 61, no. 10, pp. 5825–5837, Oct. 2026.
[C4] Autonomous current-booster chiplet accepted by ESSERC 2026
R. Chen, X. Men, …, X. Wang, et al., “An Autonomous Computational Current-Booster Chiplet for Fast Droop Mitigation…,” ESSERC 2026 (Accepted as Lecture).
[C3] Resonant-tank VPD converter accepted by IEEE ESSERC 2026 (Lecture)
X. Wang et al., “A 96.6%-Peak-Efficiency 4.63-A/mm³ Resonant-Tank Converter with RDL Trace Inductor and Trajectory Control for Vertical Power Delivery,” ESSERC 2026 (Accepted as Lecture).
[C2] Mobius accepted by IEEE ESSERC 2026 (Lecture)
X. Wang et al., “Mobius: A 12V-to-1V Charge-Cross-Converging Converter Ring with Monolithic Handshake Driving for Next-Generation AI Server,” ESSERC 2026 (Accepted as Lecture).
X. Wang et al., “Algebraic Synthesis for A Family of Inherently Balanced Multi-Phase Hybrid Switched-Capacitor Converters…,” COMPEL 2026 (Accepted as Poster).
[C7] GaN buck state-plane analysis accepted by IEEE COMPEL 2026 (Lecture)
X. Wang et al., “Geometrical State-Plane Analysis of GaN-Based Buck Converters with Auxiliary-Assisted Zero-Voltage Switching,” COMPEL 2026 (Accepted as Lecture).
[C16] Triple-path resonant-tracked VR at IEEE ISPSD 2026
R. Chen, …, X. Wang, et al., “A Triple-Path Resonant-Tracked Voltage Regulator with Package Inductor for System-on-Wafer Vertical Power Delivery,” ISPSD 2026.
[C9] Unicorn unified clock-and-power SoC at IEEE CICC 2026
X. Wang et al., “Unicorn: A Unified Clock-and-Power SoC with RL-Adapted Digital SIMO Control and In-TRO Frequency Boosting for Edge Computing,” CICC 2026.
Post-Doctoral Fellow, Department of Electronic and Computer Engineering, HKUST; affiliated with PowerSAC directed by Chair Prof. Kevin Jing Chen (IEEE Fellow).
Research focus — Integrated Power Management for Advanced Computing
Vertical Power Delivery (VPD) for 2.5D/3D integration; high-density Intermediate Bus Converters (IBC) and PoL regulators; flip-chip PMIC & SiP for AI accelerators and data centers; package-integrated multiphase IVRs.
Research focus — High-Efficiency Power Conversion & Intelligent Control
Hybrid/Resonant SC converters and trajectory-based soft switching; Digital Control, MPC, and RL for transient/efficiency optimization; SIMO converters with advanced cross-regulation suppression.
Research focus — Interdisciplinary & Emerging Technologies
Power Side-Channel Attack mitigation at circuit level; voltage-stacked power delivery; piezoelectric-resonator-based DCDC; power-timing coordination for In-Memory Computing (IMC).
X. Wang et al., “Concurrent Charge Distribution and Time-Optimal Control for Unordered Single-Inductor Dual-Output Converter,” APEC 2025, pp. 2675–2680.
7+4 flip-chip PMICs taped out — 100% silicon success
Independently spearheaded full-cycle design, tape-out, and experimental validation of 7 flip-chip PMICs; co-designed and verified an additional 4 flip-chip PMICs. Established Flip-chip PMIC and SiP design flow.
X. Wang, X. Liu, and W.-H. Ki, “A Self-Clocked and Variation-Tolerant Unified Voltage-and-Frequency Regulator for In-Order Executed Digital Loads,” IEEE TCAS-I, vol. 70, no. 11, pp. 4627–4640, Nov. 2023.
Joined Tsinghua University as Post-Doctoral Fellow & Assistant Research Fellow
School of Integrated Circuits, Tsinghua University. Awards: Beijing Municipal NSF (PI, Grant No. 4244106, 2023–2025); NSFC Key Participant (62374100); National Key R&D Key Participant (2022YFB4401100); National Program for Recruiting Overseas Postdoctoral Talent; Shuimu Tsinghua Scholarship (2023–2026).